
Product Information
Outline
A material of high thermal conductivity (low thermal resistance) made by filling silicon with a high content of our ceramic fillers. Because it efficiently transmits heat emitted from power transistors, driver ICs, etc., and at the same time, ensures insulation, NEXTECK THERMALLY CONDUCTIVE SHEET is suited to thermal control of various electronic devices.
Characteristics
Characteristic products have been developed through careful selection of a filler and combination techniques. Selection of materials according to the application and purpose is possible with these products, such as high thermal conductivity, electrical insulation performance, etc.
Applications
- Automotive electrical components
- Digital home appliances
- Power modules/power supply
- LED lighting
- FPDs (flat panel display)
- Solar cells

Thermal Interface Material
Nexteck heat spreaders(TIM) are made from high-performance cera mic materials,offering excellent thermal conductivity and electrical insulation.They are widely used in automotive electronics and AI chip applications,providing stable and efficient thermal management solutions.

Features
Electrical insulation + Low thermal resistance- Replacing PET film with high-hardness thermal interface sheet

NEXTECK (CHINA) - SHENZHEN
Tower A1001, Galaxy Century, No 3069, CaiTian Rd, Futian District, Shenzhen, China
Zip Code: 518026
Tel: +86-755-8256-1631
Fax:+86-755-8256-1691
E-mail:nexteck@nexteck.com
PRODUCTION PLANT
Wenchuan Rd, Alley 5300/1, Baoshan District, Shanghai, China
Zip Code: 200942
Tel: +86-21-3638-0189
Fax: +86-21-3638-0109
E-mail: nexteck@nexteck.com.cn